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5
Handling Recommendations
It is recommended to handle the MPL115A pressure sensor with a vacuum pick and place tool. Sharp objects utilized to move
the MPL115A pressure sensor increase the possibility of damage via a foreign object/tool into the small exposed port.
The sensor die is sensitive to light exposure. Direct light exposure through the port hole can lead to varied accuracy of pressure
measurement. Avoid such exposure to the port during normal operation.
6
Soldering/Landing Pad Information
The LGA package is compliant with the RoHS standard. It is recommended to use a no-clean solder paste to reduce cleaning
exposure to high pressure and chemical agents that can damage or reduce life span of the Pressure sensing element.
Figure 7. MPL115A1 Recommended PCB Landing Pattern
MPL115A1
Sensors
12
Freescale Semiconductor, Inc.
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